FUNGERAR BRA!
SPECIFICATIONS
*Power will vary depending on the SDRAM used.
HX430C15PB3K2/8
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR4-3000 CL15 288-Pin DIMM
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FEATURES
HyperX HX430C15PB3K2/8 is a kit of two 512M x 64-bit (4GB)
DDR4-3000 CL15 SDRAM (Synchronous DRAM) 1Rx8,
memory module, based on eight 512M x 8-bit FBGA
components per module. Each module kit supports Intel®
Extreme Memory Profiles (Intel® XMP) 2.0. Total kit
capacity is 8GB. Each module has been tested to run at
DDR4-3000 at a low latency timing of 15-17-17 at 1.35V. The
SPDs are programmed to JEDEC standard latency
DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin
DIMM uses gold contact fingers. The JEDEC standard
electrical and mechanical specifications are as follows:
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
17 cycles
45.75ns(min.)
260ns(min.)
32ns(min.)
TBD W*
94 V - 0
0o
C to +85o
C
-55o
C to +100o
C
XMP TIMING PARAMETERS
•JEDEC: DDR4-2400 CL17-17-17 @1.2V
•XMP Profile #1: DDR4-3000 CL15-17-17 @1.35V
•XMP Profile #2: DDR4-2666 CL15-17-17 @1.35V
• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD = 2.25V to 3.6V
• On-Die termination (ODT)
• 16 internal banks; 4 groups of 4 banks each
• Bi-Directional Differential Data Strobe
• 8 bit pre-fetch
• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst